Power Manager. TPS2384 Datasheet

TPS2384 Manager. Datasheet pdf. Equivalent

TPS2384 Datasheet
Recommendation TPS2384 Datasheet
Part TPS2384
Description Quad Integrated Power Sourcing Equipment Power Manager
Feature TPS2384; Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TPS2384 SL.
Manufacture etcTI
Datasheet
Download TPS2384 Datasheet





Texas Instruments TPS2384
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
TPS2384
SLUS634E – NOVEMBER 2004 – REVISED MARCH 2015
TPS2384 Quad Integrated Power Sourcing Equipment Power Manager
1 Features
1 Quad-Port Power Management With Integrated
Switches and Sense Resistors
• Compliant to IEEE 802.3af Standard
• Operates from a Single 48-V Input Supply
• Individual Port 15-bit A/D
• Auto, Semi-Auto and Power Management
Operating Modes
• Controlled Current Ramps for Reduced EMI and
Charging of PD's Bulk Capacitance
• I2C Clock and Oscillator Watchdog Timers
• Over-Temperature Protection
• DC and DC Modulated Disconnect
• Supports Legacy Detection for Non-Compliant
PD's
• Supports AC Disconnect
• High-Speed 400-kHz I2C Interface
• Comprehensive Power Management Software
Available
• Operating Temperature Range –40°C to 125°C
2 Applications
• Ethernet Enterprise Switches
• Ethernet Hubs
• SOHO Hubs
• Ethernet Mid-Spans
• PSE Injectors
3 Description
The TPS2384 is a quad-port power sourcing
equipment power manager (PSEPM) and is compliant
to the Power-over-Ethernet (PoE) IEEE 802.3af
standard. The TPS2384 operates from a single 48-V
supply and over a wide temperature range (–40°C to
125°C). The integrated output eliminates two external
components per port (FET and sense resistor) and
will survive 100-V transients. Four individual 15-bit
A/D converters are used to measure port resistance,
voltage, current and die temperature making PSE
solutions simple and robust. The TPS2384 comes
with a comprehensive software solution to meet the
most demanding applications which can serve as a
core for all PoE system designs.
TheTPS2384 is available in either 64-pin
PowerPAD™ down (PAP) or 64-pin PowerPAD™ up
(PJD) packages.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS2384
HTQFP (64)
10.0mm x 10.0mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Typical Application
PSE
Up to 100 m
RJ45 of CAT 5 RJ45
+48 V
Spare Pair
Optional
MSP430
Micro-
Controller
TPS2384
SCL
SDA - I
SDA - O
+48 V
Return
Singnal Pair
Singnal Pair
TPS2375
ILIM
CLASS
DC/DC
Converter
Spare Pair
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments TPS2384
TPS2384
SLUS634E – NOVEMBER 2004 – REVISED MARCH 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Typical Application ................................................ 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 7
7.1 Absolute Maximum Ratings ...................................... 7
7.2 ESD Ratings ............................................................ 7
7.3 Recommended Operating Conditions....................... 7
7.4 Thermal Information .................................................. 7
7.5 Electrical Characteristics........................................... 7
7.6 Timing Requirements ............................................... 9
7.7 Typical Characteristics ............................................ 10
8 Parameter Measurement Information ................ 11
9 Detailed Description ............................................ 12
9.1 Overview ................................................................. 12
9.2 Functional Block Diagrams ..................................... 13
9.3 Feature Description................................................. 14
9.4 Device Functional Modes........................................ 15
9.5 Programming........................................................... 31
9.6 Register Maps ........................................................ 34
10 Application and Implementation........................ 43
10.1 Application Information.......................................... 43
10.2 Typical Application ............................................... 44
11 Power Supply Recommendations ..................... 46
12 Layout................................................................... 47
12.1 Layout Guidelines ................................................. 47
12.2 Layout Example .................................................... 47
12.3 Thermal Consideration.......................................... 48
13 Device and Documentation Support ................. 49
13.1 Documentation Support ....................................... 49
13.2 Trademarks ........................................................... 49
13.3 Electrostatic Discharge Caution ............................ 49
13.4 Glossary ................................................................ 49
14 Mechanical, Packaging, and Orderable
Information ........................................................... 49
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2007) to Revision E
Page
• Added ESD Rating table, Thermal Information table Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
• Changed text in the description of pins A1-A5 From: "connecting to chip ground" To: "connecting to digital ground" ......... 6
• Changed the first 5 rows in the Digital I2C DC Spec3ifications of the Electrical Characteristics ........................................... 9
• Added values for Discovery1,2 A/D conversion time in Timing Requirements TYP = 18, MAX = 22 ms.............................. 9
• Changed text in the Auto Mode From: "please contact the factory for additional application information." To: "refer to
(SLUZ014)". .......................................................................................................................................................................... 15
• Changed text in Start/Stop from "and not used by the TPS2384." To: (See Note (1) in Table 1) ........................................ 32
• Changed text in the first sentence of Chip Address ............................................................................................................ 32
• Added Note (1) to Table 1 .................................................................................................................................................... 33
• Changed text in Note 2 of Table 5 From: "Consult factory for Alternative B,." To: "refer to (SLUZ014) "for Alternative
B,." ........................................................................................................................................................................................ 37
• Changed text in Note 2 of Table 7 From: "Consult factory for Alternative B,." To: "refer to (SLUZ014) "for Alternative
B,." ........................................................................................................................................................................................ 38
• Changed the connections to pins 50 and 51 in Figure 40 ................................................................................................... 44
(1) TPS2384 will acknowledge four slave address values for each setting of A5-A1 (A7,A6 = 00, 01, 10, 11). Slave devices sharing the bus
with TPS2384(s) should use unique A5-A1 values not matching those of the TPS2384(s).
2 Submit Documentation Feedback
Product Folder Links: TPS2384
Copyright © 2004–2015, Texas Instruments Incorporated



Texas Instruments TPS2384
www.ti.com
6 Pin Configuration and Functions
PAP Package
64-Pin HTQFP
Top View
TPS2384
SLUS634E – NOVEMBER 2004 – REVISED MARCH 2015
(1) NIC = No internal connection. Pins are floating.
(2) NIC pins can be tied to the ground plane for improved thermal characteristics and to prevent noise injection from
unused pins.
(3) NIC pins next to CINT pins should be tied to ground to prevent noise injection into A/D converter.
Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: TPS2384
Submit Documentation Feedback
3





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)