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MSA-0636

Hewlett-Packard
Part Number MSA-0636
Manufacturer Hewlett-Packard
Description (MSA-0635 / MSA-0636) Cascadable Silicon Bipolar MMIC Amplifier
Published Mar 3, 2006
Detailed Description Cascadable Silicon Bipolar MMIC␣ Amplifiers Technical Data MSA-0635, -0636 Features • Cascadable 50 Ω Gain Block • Low ...
Datasheet PDF File MSA-0636 PDF File

MSA-0636
MSA-0636

Overview
Cascadable Silicon Bipolar MMIC␣ Amplifiers Technical Data MSA-0635, -0636 Features • Cascadable 50 Ω Gain Block • Low Operating Voltage: 3.
5 V Typical Vd • 3 dB Bandwidth: DC to 0.
9 GHz • High Gain: 19.
0␣ dB Typical at 0.
5 GHz • Low Noise Figure: 2.
8 dB Typical at 0.
5 GHz • Cost Effective Ceramic Microstrip Package designed for use as a general purpose 50 Ω gain block.
Typical applications include narrow and broad band IF and RF amplifiers in commercial and industrial applications.
The MSA-series is fabricated using HP’s 10 GHz fT, 25␣ GHz f MAX, silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability.
The use of an external bias resistor for temperature and current stability also allows bias flexibility.
Available in cut lead version (package 36) as MSA-0636.
35 micro-X Package[1] Note: 1.
Short leaded 36 package available upon request.
Description The MSA-0635 is a high performance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) housed in a cost effective, microstrip package.
This MMIC is Typical Biasing Configuration R bias VCC > 5 V RFC (Optional) 4 C block 3 IN 1 MSA C block OUT Vd = 3.
5 V 2 5965-9585E 6-370 MSA-0635, -0636 Absolute Maximum Ratings Parameter Device Current Power Dissipation[2,3] RF Input Power Junction Temperature Storage Temperature[4] Absolute Maximum[1] 50 mA 200 mW +13 dBm 200°C –65 to 200°C Thermal Resistance[2,5]: θjc = 155°C/W Notes: 1.
Permanent damage may occur if any of these limits are exceeded.
2.
TCASE = 25°C.
3.
Derate at 6.
5 mW/°C for TC > 169°C.
4.
Storage above +150°C may tarnish the leads of this package making it difficult to solder into a circuit.
5.
The small spot size of this technique results in a higher, though more accurate determination of θjc than do alternate methods.
See MEASUREMENTS section “Thermal Resistance” for more information.
Electrical Specifications[1], TA = 25°C Symbo...


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