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BSP204

NXP
Part Number BSP204
Manufacturer NXP
Description P-channel enhancement mode vertical D-MOS transistor
Published Mar 23, 2005
Detailed Description DISCRETE SEMICONDUCTORS DATA SHEET BSP204; BSP204A P-channel enhancement mode vertical D-MOS transistor Product specifi...
Datasheet PDF File BSP204 PDF File

BSP204
BSP204

Overview
DISCRETE SEMICONDUCTORS DATA SHEET BSP204; BSP204A P-channel enhancement mode vertical D-MOS transistor Product specification File under Discrete Semiconductors, SC13b April 1995 Philips Semiconductors Product specification P-channel enhancement mode vertical D-MOS transistor FEATURES • Direct interface to C-MOS, TTL, etc.
• High-speed switching • No secondary breakdown.
DESCRIPTION P-channel enhancement mode vertical D-MOS transistor in a TO-92 variant envelope, intended for use in relay, high-speed and line transformer drivers.
PINNING - TO-92 variant (BSP204) PIN 1 2 3 gate drain source DESCRIPTION handbook, halfpage BSP204; BSP204A QUICK REFERENCE DATA SYMBOL −VDS −ID RDS(on) VGS(th) PARAMETER drain-source voltage drain current drain-source on-resistance gate-source threshold voltage DC value −ID = 200 mA −VGS = 10 V −ID = 1 mA VGS = VDS CONDITIONS MAX.
200 250 15 2.
8 UNIT V mA Ω V PIN CONFIGURATION 1 d 2 3 g s MAM147 PINNING - TO-92 variant (BSP204A) PIN 1 2 3 gate drain DESCRIPTION source Fig.
1 Simplified outline and symbol.
April 1995 2 Philips Semiconductors Product specification P-channel enhancement mode vertical D-MOS transistor LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134).
SYMBOL −VDS ±VGSO −ID −IDM Ptot Tstg Tj Note PARAMETER drain-source voltage gate-source voltage drain current drain current total power dissipation storage temperature range junction temperature DC value peak value up to Tamb = 25 °C (note 1) CONDITIONS BSP204; BSP204A MIN.
− − − − − −65 − MAX.
200 20 250 600 1 150 150 UNIT V V mA mA W °C °C 1.
Device mounted on an epoxy printed-circuit board, maximum lead length 4 mm; mounting pad for the drain lead minimum 10 mm x 10 mm.
THERMAL RESISTANCE SYMBOL Rth j-a Note 1.
Device mounted on an epoxy printed-circuit board, maximum lead length 4 mm; mounting pad for the drain lead minimum 10 mm x 10 mm.
PARAMETER from junction to ambient (note 1) VALUE 125 UNIT K/W April 1995 3 Philips Semiconduc...


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