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BSP19

NXP
Part Number BSP19
Manufacturer NXP
Description NPN high-voltage transistors
Published Mar 23, 2005
Detailed Description DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D087 BSP19; BSP20 NPN high-voltage transistors Product specificat...
Datasheet PDF File BSP19 PDF File

BSP19
BSP19


Overview
DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D087 BSP19; BSP20 NPN high-voltage transistors Product specification Supersedes data of 1997 Mar 03 1999 Jun 01 Philips Semiconductors Product specification NPN high-voltage transistors FEATURES • Low current (max.
100 mA) • High voltage (max.
350 V).
APPLICATIONS • Switching and amplification • Especially used in telephony and automotive applications.
DESCRIPTION handbook, halfpage BSP19; BSP20 PINNING PIN 1 2, 4 3 base collector emitter DESCRIPTION 4 2, 4 1 NPN transistor in a SOT223 plastic package.
PNP complement: BSP16.
1 Top view 2 3 MAM287 3 Fig.
1 Simplified outline (SOT223) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL VCBO BSP19 BSP20 VCEO collector-emitter voltage BSP19 BSP20 VEBO IC IB Ptot Tstg Tj Tamb Note 1.
Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”.
emitter-base voltage collector current (DC) base current (DC) total power dissipation storage temperature junction temperature operating ambient temperature Tamb ≤ 25 °C; note 1 open collector open base − − − − − − −65 − −65 350 250 5 100 100 1.
2 +150 150 +150 V V V mA mA W °C °C °C PARAMETER collector-base voltage CONDITIONS open emitter − − 400 300 V V MIN.
MAX.
UNIT 1999 Jun 01 2 Philips Semiconductors Product specification NPN high-voltage transistors THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s Note PARAMETER thermal resistance from junction to ambient thermal resistance from junction to soldering point CONDITIONS note 1 BSP19; BSP20 VALUE 104 23 UNIT K/W K/W 1.
Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”.
CHARACTERISTICS Tj =...


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