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BSP31

NXP
Part Number BSP31
Manufacturer NXP
Description PNP medium power transistors
Published Mar 23, 2005
Detailed Description DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BSP31; BSP32; BSP33 PNP medium power transistors Product spe...
Datasheet PDF File BSP31 PDF File

BSP31
BSP31

Overview
DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D087 BSP31; BSP32; BSP33 PNP medium power transistors Product specification Supersedes data of 1997 Apr 08 1999 Apr 26 Philips Semiconductors Product specification PNP medium power transistors FEATURES • High current (max.
1 A) • Low voltage (max.
80 V).
APPLICATIONS • Telephony and general industrial applications.
DESCRIPTION PNP medium power transistor in a SOT223 plastic package.
NPN complements: BSP41 and BSP43.
handbook, halfpage BSP31; BSP32; BSP33 PINNING PIN 1 2, 4 3 base collector emitter DESCRIPTION 4 2, 4 1 3 1 Top view 2 3 MAM288 Fig.
1 Simplified outline (SOT223) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL VCBO BSP31 BSP32; BSP33 VCEO collector-emitter voltage BSP31 BSP32; BSP33 VEBO IC ICM IBM Ptot Tstg Tj Tamb Note 1.
Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”.
emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation storage temperature junction temperature operating ambient temperature Tamb = 25 °C; note 1 open collector open base − − − − − − − −65 − −65 −60 −80 −5 −1 −2 −200 1.
3 +150 150 +150 V V V A A mA W °C °C °C PARAMETER collector-base voltage CONDITIONS open emitter − − −70 −90 V V MIN.
MAX.
UNIT 1999 Apr 26 2 Philips Semiconductors Product specification PNP medium power transistors THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s Note PARAMETER thermal resistance from junction to ambient thermal resistance from junction to soldering point BSP31; BSP32; BSP33 CONDITIONS note 1 VALUE 93 12 UNIT K/W K/W 1.
Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for SOT223 in the General ...


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