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BSP52

NXP
Part Number BSP52
Manufacturer NXP
Description NPN Darlington transistors
Published Mar 23, 2005
Detailed Description DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D087 BSP50; BSP51; BSP52 NPN Darlington transistors Product s...
Datasheet PDF File BSP52 PDF File

BSP52
BSP52

Overview
DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D087 BSP50; BSP51; BSP52 NPN Darlington transistors Product specification Supersedes data of 1997 Apr 22 1999 Apr 23 Philips Semiconductors Product specification NPN Darlington transistors FEATURES • High current (max.
1 A) • Low voltage (max.
80 V) • Integrated diode and resistor.
APPLICATIONS • Industrial high gain amplification.
PINNING PIN 1 2,4 3 BSP50; BSP51; BSP52 DESCRIPTION base collector emitter 4 2, 4 DESCRIPTION NPN Darlington transistor in a SOT223 plastic package.
PNP complements: BSP60, BSP61 and BSP62.
1 Top view 2 3 MAM265 1 3 Fig.
1 Simplified outline (SOT223) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL VCBO BSP50 BSP51 BSP52 VCES collector-emitter voltage BSP50 BSP51 BSP52 VEBO IC ICM IB Ptot Tstg Tj Tamb Note 1.
Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for the SOT223 in the General Part of associated Handbook”.
emitter-base voltage collector current (DC) peak collector current base current (DC) total power dissipation storage temperature junction temperature operating ambient temperature open collector VBE = 0 − − − − − − − Tamb ≤ 25 °C; note 1 − −65 − −65 45 60 80 5 1 2 100 1.
25 +150 150 +150 V V V V A A mA W °C °C °C PARAMETER collector-base voltage CONDITIONS open emitter − − − 60 80 90 V V V MIN.
MAX.
UNIT 1999 Apr 23 2 Philips Semiconductors Product specification NPN Darlington transistors THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s Note PARAMETER thermal resistance from junction to ambient thermal resistance from junction to solder point BSP50; BSP51; BSP52 CONDITIONS note 1 VALUE 96 17 UNIT K/W K/W 1.
Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for the SOT223 i...


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