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BSP77

Infineon Technologies AG
Part Number BSP77
Manufacturer Infineon Technologies AG
Description Smart Lowside Power Switch
Published Mar 23, 2005
Detailed Description HITFETÒ II.Generation BSP 77 Smart Lowside Power Switch Features · Logic Level Input · Input Protection (ESD) · Thermal...
Datasheet PDF File BSP77 PDF File

BSP77
BSP77

Overview
HITFETÒ II.
Generation BSP 77 Smart Lowside Power Switch Features · Logic Level Input · Input Protection (ESD) · Thermal shutdown with auto restart · Overload protection · Short circuit protection · Overvoltage protection · Current limitation · Analog driving possible 1 3 2 VPS05163 Product Summary Drain source voltage On-state resistance Nominal load current Clamping energy VDS RDS(on) ID(Nom) EAS 4 42 100 2.
17 250 V mW A mJ Application · All kinds of resistive, inductive and capacitive loads in switching or linear applications · µC compatible power switch for 12 V DC applications · Replaces electromechanical relays and discrete circuits General Description N channel vertical power FET in Smart SIPMOS Ò technology.
Fully protected by embedded protection functions.
Vbb M HITFET â Current Limitation In Pin 1 Drain OvervoltageProtection Pin 2 and 4 (TAB) Gate-Driving Unit Overtemperature Protection ESD Overload Protection Short circuit Protection Pin 3 Source Complete product spectrum and additional information http://www.
infineon.
com/hitfet Page 1 2004-03-05 BSP 77 Maximum Ratings at Tj = 25°C, unless otherwise specified Parameter Drain source voltage Supply voltage for full short circuit protection Continuous input voltage1) Continuous input current2) -0.
2V £ VIN £ 10V VIN < -0.
2V or VIN > 10V Operating temperature Storage temperature Power dissipation 5) TC = 85 °C Unclamped single pulse inductive energy 2) Load dump protection VLoadDump2)3) = VA + VS VIN = 0 and 10 V, td = 400 ms, RI = 2 W, RL = 6 W, VA = 13.
5 V Electrostatic discharge voltage2) (Human Body Model) VESD according to Jedec norm EIA/JESD22-A114-B, Section 4 Jedec humidity category,J-STD-20-B IEC climatic category; DIN EN 60068-1 Thermal resistance junction - ambient: @ min.
footprint @ 6 cm 2 cooling area 4) junction-soldering point: 1For input voltages beyond these limits I has to be limited.
IN 2not subject to production test, specified by design 3V Loaddump is setup without the DU...


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